AGFA023R31C2E2V

Soc System On Chip Overview

The AGFA023R31C2E2V is an Agilex F Series System-on-Chip featuring a 2.3M logic element FPGA fabric and a quad-core ARM Cortex-A53 processor running at 1.4GHz. It integrates 256KB RAM, supports up to 480 I/Os, and operates within a 0°C to 100°C junction temperature range. The device utilizes a 3184-ball BGA package with dimensions of 56x45 mm.

Soc System On Chip Feature Summary

• Integrated quad-core ARM Cortex-A53 MPCore with CoreSight debug support
• Hybrid architecture combining 2.3M LE FPGA fabric with embedded processing
• Support for diverse connectivity including Ethernet, USB OTG, and SPI

Soc System On Chip Applications

• High-performance embedded computing systems requiring mixed signal processing
• Industrial automation controllers with real-time deterministic requirements
• Network infrastructure equipment utilizing integrated Ethernet interfaces
• Medical imaging devices needing low-latency data acquisition and processing

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official Altera documentation to confirm electrical grade and packaging details. Confirm availability through authorized distributors as lead times may vary. Ensure compliance with RoHS directives and check for any recent Product Change Notices regarding labeling or design revisions before finalizing procurement orders.

Soc System On Chip Selection Notes

Select this component when a balance between programmable logic capacity and hard processor system performance is required. The 3184-BGA package suits applications with moderate pin count needs. Consider thermal management solutions given the 100°C TJ limit. Evaluate if the 2.3M LE density meets system complexity without over-provisioning resources available in larger Agilex variants.

Soc System On Chip Part Context

This part belongs to the Agilex 7 F-Series family, designed for cost-sensitive applications requiring robust FPGA capabilities alongside embedded processing. It shares architectural similarities with other Agilex SoCs but offers specific logic density and I/O configurations tailored for mid-range industrial and commercial deployments.

Soc System On Chip Replacement Considerations

Direct replacements within the same package and functionality require matching Agilex F-Series parts with equivalent logic density. Verify pin compatibility and electrical specifications carefully. No public confirmed substitutes are listed; consult manufacturer guidelines for obsolescence management.