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APT40M75JN is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is MOSFET N-CH 400V 56A ISOTOP. Review the specifications below when checking this part for your BOM.
The APT40M75JN is an N-channel enhancement mode high voltage power MOSFET from Microsemi Corporation, utilizing the POWER MOS IV technology. It features a single die ISOTOP package (SOT-227) designed for base mounting applications. The device provides a drain-source breakdown voltage of 400V and a continuous drain current of 56A at a case temperature of 25°C. Its maximum on-state resistance is specified as 0.075 ohms when driven by a gate-source voltage of 10V. Total power dissipation reaches 520W under standard thermal conditions.
Verify component authenticity through authorized distribution channels due to potential counterfeit risks. Confirm that the specific ordering suffix matches the required electrical tolerances and packaging format. Ensure proper electrostatic discharge handling procedures are followed during storage and installation to prevent damage to the sensitive internal die structure.
Select this component for designs requiring robust high-voltage switching capabilities with low conduction losses. Evaluate thermal management requirements carefully, as performance depends heavily on maintaining appropriate case temperatures. Consider the total gate charge specifications when designing driver circuits to ensure optimal switching efficiency and minimize switching losses in the application.
This part belongs to the APT40M series of high voltage power MOSFETs manufactured by Microsemi. It shares the same SOT-227 ISOTOP package form factor with other variants in the lineup but differs in specific electrical ratings such as on-resistance and current handling capacity. The series represents a generation of devices optimized for improved power density and switching performance.
APT40M90JN
The maximum operating and storage junction temperature range extends up to 150°C.
The device utilizes a base mount configuration secured with hex nuts, providing a large thermal interface area for heat dissipation.
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