APT8024LFLLG

Single FETs, MOSFETs Overview

The APT8024LFLLG is an N-channel Power MOS 7 FREDFET manufactured by Microchip Technology. It features a maximum drain-source voltage of 800 V and a continuous drain current of 31 A at case temperature. The device has a maximum on-state resistance of 260 mΩ. It operates within a temperature range of -55°C to +150°C and utilizes a TO-264 (L) package with screw mount installation.

Single FETs, MOSFETs Feature Summary

• High-speed switching capability with low electromagnetic interference characteristics
• Robust thermal performance suitable for high-power applications
• Designed for use in switch-mode power transistors

Single FETs, MOSFETs Applications

• Switch-mode power supplies
• High-voltage inverter circuits
• Motor control systems

Single FETs, MOSFETs Procurement Notes

Verify the specific suffix 'LFLLG' against official Microchip documentation to confirm pinout, packaging, and RoHS compliance status. Ensure the procurement channel provides valid traceability for this discrete component. Cross-reference datasheet revisions to confirm electrical parameters match design requirements before finalizing orders.

Single FETs, MOSFETs Selection Notes

Select this component for designs requiring 800 V blocking voltage and moderate current handling. The TO-264 package facilitates through-hole mounting. Evaluate thermal management needs given the 565 W power dissipation rating at case temperature. Confirm gate drive compatibility with the specified voltage limits.

Single FETs, MOSFETs Part Context

This part belongs to the Microchip Power MOS 7 family of high-voltage N-channel MOSFETs. These devices are engineered for improved switching performance and reduced EMI compared to previous generations. The family targets industrial and consumer power conversion applications requiring reliable high-voltage switching.

Single FETs, MOSFETs Replacement Considerations

Check for direct substitutes such as the APT8024JLL or APT8024B2LLG from the same manufacturer. Verify that alternative packages like SOT-227 or T-Max-3 fit the existing board layout and thermal constraints before substitution.