APT8024LLLG

Single FETs, MOSFETs Overview

The APT8024LLLG is a silicon N-channel Power MOSFET manufactured by Microsemi Corporation. It utilizes the T-MAX-3 through-hole package and features an integrated body diode. The device is designed for high-voltage switching applications, offering low on-resistance and robust avalanche energy handling capabilities within its specified operating temperature range.

Single FETs, MOSFETs Feature Summary

• N-channel enhancement mode operation with metal-oxide semiconductor technology
• Integrated monolithic fast-recovery body diode
• High voltage blocking capability suitable for power conversion circuits
• Through-hole mounting configuration for reliable thermal dissipation

Single FETs, MOSFETs Applications

• DC-DC converter topologies
• Motor control systems
• Industrial power supplies

Single FETs, MOSFETs Procurement Notes

Verify the specific suffix 'LLLG' against official Microsemi documentation to confirm exact electrical tolerances and marking codes. Ensure the procurement channel provides traceability for this component type. Confirm RoHS compliance status if required by the end application specifications before finalizing orders.

Single FETs, MOSFETs Selection Notes

Select this component based on the required drain-source voltage rating and continuous current capacity for the target circuit. Evaluate the thermal resistance characteristics of the T-MAX-3 package against the system's heat sinking strategy. Compare the gate charge parameters with the driving circuit capabilities to ensure efficient switching performance.

Single FETs, MOSFETs Part Context

This part belongs to the APT series of power MOSFETs from Microsemi, which are engineered for general-purpose power switching. The series emphasizes reliability in industrial environments. The T-MAX-3 package provides a standardized form factor for legacy and modern through-hole designs requiring high power density.

Single FETs, MOSFETs Replacement Considerations

Consult official cross-reference lists for verified substitutes. Generic replacements may differ in avalanche ruggedness or thermal characteristics. Verify pinout compatibility and package dimensions before integrating alternative components into existing PCB layouts.