APT9M100B

Single FETs, MOSFETs Overview

The APT9M100B is a surface-mount N-channel Power MOSFET from the POWER MOS 8 series, manufactured by Microchip Technology. It features a TO-247 package with a drain-source voltage rating of 1000 V and a continuous drain current of 9 A at case temperature. The device exhibits a maximum on-state resistance of 1400 mΩ at 5 A and 10 V gate drive. Key electrical parameters include a gate charge of 80 nC, input capacitance of 2605 pF, and a power dissipation capacity of 335 W. It operates within a junction temperature range of -55°C to 150°C.

Single FETs, MOSFETs Feature Summary

• Rugged construction designed for harsh environments
• High voltage capability suitable for industrial applications
• Single channel N-channel configuration

Single FETs, MOSFETs Applications

• Industrial motor control systems
• Power supply circuits
• Inverter applications

Single FETs, MOSFETs Procurement Notes

Verify the specific package variant (TO-247) against project requirements. Confirm that the 1400 mΩ on-resistance meets thermal management constraints. Ensure compatibility with standard TO-247 mounting hardware. Check for lead-free compliance if required by assembly specifications.

Single FETs, MOSFETs Selection Notes

Select this component for high-voltage switching applications requiring robust performance in demanding conditions. Compare the 9 A current rating and 1000 V breakdown voltage against circuit demands. Evaluate thermal resistance and heat sinking needs given the 335 W dissipation rating. Consider the 10 V gate drive requirement for driver compatibility.

Single FETs, MOSFETs Part Context

This part belongs to Microchip's POWER MOS 8 series, which focuses on ruggedness and versatility. It serves as a discrete semiconductor solution for power switching. The TO-247 package provides mechanical stability and efficient heat transfer compared to smaller surface-mount options.

Single FETs, MOSFETs Replacement Considerations

APT9M100S is a similar surface-mount variant in the same series. Verify pinout and thermal characteristics when substituting between through-hole and surface-mount packages.