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APTM50SKM17G is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is MOSFET N-CH 500V 180A SP6. Review the specifications below when checking this part for your BOM.
The APTM50SKM17G is a single N-channel MOSFET module from Microchip Technology, utilizing silicon technology. It features a SP6 package designed for chassis mounting. The device supports a drain-to-source voltage (Vdss) of 500 V and offers a typical on-resistance (Rds(on)) of 17 mΩ. At a case temperature of 80°C, the continuous drain current rating is 140 A, while the maximum power dissipation reaches 1250 W under thermal control conditions. The operating junction temperature range spans from -40°C to 150°C.
Verify the specific suffix and revision level against the official Microchip datasheet to ensure compatibility with your design requirements. Confirm that the SP6 package dimensions and mounting hole patterns match your chassis specifications. Check for any recent Product Change Notifications (PCNs) that may affect pinout or material composition before finalizing procurement orders.
Select this component when a single high-current N-channel switch is required with low on-resistance characteristics. Ensure the thermal design can handle the 1250 W dissipation limit at the expected case temperature. Verify that the 500 V breakdown voltage exceeds the maximum circuit voltage spikes. Compare against other SP6 variants if different current ratings or resistance values are needed.
This module belongs to the broader portfolio of discrete and power modules offered by Microchip Technology. It is categorized under MOSFET modules and utilizes standard silicon technology. The SP6 package is a common form factor for high-power discrete components, allowing for standardized mounting solutions across various industrial and commercial power electronics applications.
Consult the official Microchip documentation for direct cross-reference part numbers. Ensure any substitute maintains the SP6 package footprint, 500 V rating, and comparable Rds(on) values. Verify that the replacement device meets the same thermal and electrical performance standards required by the original design.
The maximum power dissipation is 1250 W when measured at the case temperature.
No, it is housed in an SP6 package designed specifically for chassis mounting.
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