AS4C256M16D3-12BCN

Memory IC Overview

The AS4C256M16D3-12BCN is a 4 Gbit DDR3 SDRAM manufactured by Alliance Memory. It features a 256 M x 16 organization and operates at a maximum clock frequency of 800 MHz. The device utilizes a 96-ball FBGA package for surface mount installation. Electrical specifications include an access time of 20 ns, with a supply voltage range from 1.425 V to 1.575 V. It supports commercial operating temperatures between 0°C and +95°C.

Memory IC Feature Summary

• Supports double data rate architecture for high-speed data transfer
• Includes eight internal banks for efficient memory management
• Features automatic refresh and self-update capabilities

Memory IC Applications

• Machine tool systems requiring large capacity and high speed
• Industrial control equipment
• Consumer electronics devices

Memory IC Procurement Notes

Verify the exact part number suffix against official datasheets, as variations such as LC or B indicate different voltage levels or die revisions. Confirm moisture sensitivity handling requirements prior to assembly. Ensure compatibility with system power supplies and thermal constraints before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when a 4 Gbit density with a 16-bit interface is required. The 800 MHz speed grade suits applications needing moderate bandwidth. Verify that the standard 1.5V operation aligns with the target system's power design rather than low-voltage variants.

Memory IC Part Context

This part belongs to the Alliance Memory DDR3 SDRAM family, designed for general-purpose high-density memory applications. It complements other members like the AS4C256M16D3LC series, which offers lower voltage options. The FBGA-96 package allows for compact board layouts in space-constrained electronic designs.

Memory IC Replacement Considerations

The AS4C256M16D3B-12BCN is a confirmed substitute within the same manufacturer lineup.