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AUIRF2804L is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 40V 195A TO262. Review the specifications below when checking this part for your BOM.
The AUIRF2804L is an automotive-grade, single N-channel HEXFET power MOSFET manufactured by Infineon Technologies. It utilizes advanced process technology to achieve ultra-low on-resistance and fast switching capabilities within a TO-262 (I2PAK) through-hole package. The device supports a maximum drain-source voltage of 40V and offers a continuous drain current of 195A limited by the package, with a silicon-limited rating of 270A. It features a maximum static drain-to-source on-resistance of 2.0mΩ at VGS=10V and operates reliably up to a junction temperature of 175°C.
Verify that the specific order quantity matches the standard tube packaging configuration provided by the manufacturer. Confirm compliance with RoHS directives and lead-free requirements before finalizing procurement. Ensure storage conditions adhere to the specified moisture sensitivity level to prevent package damage during assembly.
Select this component when designing circuits requiring automotive qualification and high surge current handling. The TO-262 package provides a balance between thermal dissipation and mechanical mounting flexibility compared to surface-mount alternatives. Evaluate the 195A package-limited current against the application's peak load requirements to ensure safe operation margins.
This part belongs to the HEXFET family of power MOSFETs designed for efficiency and reliability. It shares core electrical characteristics with the AUIRF2804 and AUIRF2804S variants, differing primarily in the physical package type. The TO-262 form factor distinguishes it from the TO-220AB and D2Pak versions while maintaining identical semiconductor performance specifications.
Direct replacements include AUIRF2804 (TO-220AB package) and AUIRF2804S (D2Pak package). Verify that the alternative package fits the PCB footprint and thermal management design constraints.
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