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BD18IC0WEFJ-E2 is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is IC REG LINEAR 1.8V 1A 8-HTSOP-J. Review the specifications below when checking this part for your BOM.
The BD18IC0WEFJ-E2 is a high-accuracy LDO voltage regulator manufactured by ROHM Semiconductor. It provides a fixed positive output of 1.8 V with a maximum load current of 1 A. The device operates within an input voltage range of 2.4 V to 5.5 V and features a typical dropout voltage of 400 mV at full load. Quiescent current is specified at 500 uA. It supports surface-mount installation in an HTSOP-J8 package and functions reliably across a temperature range of -40 C to +105 C.
Verify the specific suffix E2 against official ROHM documentation to confirm pinout compatibility and environmental compliance status. Ensure the HTSOP-J8 package dimensions match your PCB footprint constraints. Cross-reference the datasheet revision date to validate thermal performance specifications for your intended operating temperature range before finalizing procurement orders.
Select this component when a low-input voltage LDO is required for automotive or industrial applications. The 1.8 V output suits digital logic families needing regulated power. Consider the 400 mV dropout characteristic relative to your minimum input voltage. The wide operating temperature range ensures reliability in harsh environments compared to standard commercial grade alternatives.
This part belongs to the BD18 series of high-accuracy LDO regulators designed for automotive use. It shares the HTSOP-J8 package form factor with other variants in the family but differs in input voltage limits and output current capabilities. The IC integrates internal protection mechanisms typical of modern linear regulators for robust system operation.
Direct substitutes include BD18HA5WEFJ-E2 and BD18GC0VEFJ-ME2, though input voltage ranges and quiescent currents differ. Verify pin-to-pin compatibility and thermal dissipation requirements before swapping components in existing designs.
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