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BL 2 66 Z is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is Stamped contact spring (fork con. Review the specifications below when checking this part for your BOM.
The BL 2 66 Z is a PCB receptacle from the Fischer Elektronik BL 2 series, designed for board-to-board connections. It features a through-hole straight mounting configuration with a 0.100 inch (2.54 mm) pitch and two rows of contacts, totaling 66 positions. The connector utilizes stamped contact springs with a fork contact design. Electrical ratings include 3 A current capacity and 125 V voltage. The operating temperature range spans from -40°C to +200°C, with soldering resistance up to 260°C for 10 seconds. The housing meets UL 94 V-0 flammability standards.
Verify that the specific part number matches the required 66-position configuration and straight orientation. Confirm that the supplier provides documentation confirming UL 94 V-0 compliance and the specified electrical ratings. Ensure compatibility with standard 2.54 mm pitch mating connectors before finalizing procurement orders.
Select this component when a high-density, low-profile connection is required for rigid PCB assemblies. The straight through-hole format ensures mechanical stability during operation. Consider the 3 A rating for power distribution needs within the defined voltage limits. Evaluate space constraints against the physical dimensions of the dual-row header.
This component belongs to the BL 2 series, which specializes in stamped contact spring technology. Fischer Elektronik designs these connectors for robust performance in demanding environments. The series emphasizes durability and precise alignment for consistent electrical contact across various industrial applications.
Direct substitutes must maintain the 66-pin count, 2.54 mm pitch, and through-hole straight form factor. Verify that alternative suppliers offer identical fork contact designs and UL 94 V-0 rated housings to ensure functional equivalence without redesigning the PCB footprint.
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