SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The BL67-2RFID-S is an IP67-rated modular interface module designed for UHF RFID applications within the Turck BL67 remote I/O system. It provides two integrated ports for connecting external UHF RFID read/write heads, enabling direct data acquisition from tags in harsh industrial environments. The unit features a robust metal housing suitable for field mounting and includes LED indicators for status and diagnostic monitoring. It supports standard communication protocols to facilitate seamless integration with PLCs or controllers via the BL67 backplane bus.
Verify that the specific firmware version matches the required RFID protocol standards for the connected read heads. Confirm compatibility with the existing BL67 base unit and backplane power supply requirements. Ensure the selected antenna cables meet the length and shielding specifications for the installation environment to maintain signal integrity.
Select this module when dual-channel UHF RFID connectivity is required at the field level without additional gateways. It is suitable for applications needing ruggedized hardware directly exposed to environmental stressors. Consider this option over separate readers if space constraints exist on the machine panel or if centralized I/O architecture is preferred.
This component belongs to the BL67 family of modular I/O systems, which are designed for decentralized automation. The series allows for flexible expansion of digital and analog signals alongside specialized functions like RFID. The BL67 platform emphasizes reduced wiring complexity and faster commissioning through standardized plug-in modules.
Direct substitution requires matching the IP67 rating and dual-port RFID capability. Verify electrical compatibility with the host controller's communication protocol. Ensure physical dimensions fit the existing DIN rail or mounting configuration.

Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read MoreA digital-to-analog converter (DAC) turns a digital number into an analog voltage or current. It lets a controller set a physical output, such as…
Read More
Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More