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BLM 1 SMD 10 Z is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is wide isolation body - suitable f. Review the specifications below when checking this part for your BOM.
The BLM 1 SMD 10 Z is a surface mount board-to-board header connector manufactured by Fischer Elektronik. It features a 1.27 mm (0.050 inch) pitch and provides 10 contacts arranged in a single row. The connector utilizes a wide isolation body design, which is compatible with male headers from the SLM and SLV series. The contact plating is tin, ensuring reliable electrical connections for surface mount assembly processes on printed circuit boards.
Verify the exact contact count matches the '10' designation in the model number to ensure correct pinout alignment. Confirm that the surface mount package type aligns with the target PCB footprint specifications. Check that the tin plating specification meets the required environmental or solderability standards for the intended manufacturing process.
Select this component when a low-profile, single-row surface mount header is required for connecting daughterboards to main logic boards. Ensure the mating male connector belongs to the SLM or SLV series to guarantee proper fit within the wide isolation body constraints. Consider the 1.27 mm pitch requirement against available routing space on the target PCB layout.
This part belongs to the BLM 1 SMD series of connectors produced by Fischer Elektronik. The series offers various contact counts ranging from 4 to 20 positions, all sharing the same 1.27 mm pitch and surface mount form factor. The '10 Z' suffix specifically denotes the 10-position variant with tin-plated contacts, distinguishing it from other lengths or plating options within the same family.
Direct substitutes must maintain the 1.27 mm pitch, 10-position count, and surface mount orientation. Verify mechanical compatibility with SLM or SLV mating headers. Generic equivalents may differ in isolation body width or contact material, requiring re-verification of the assembly footprint and electrical interface.
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