BLM 2 SMD 18 G

Headers, Receptacles, Female Sockets Overview

The Fischer Elektronik BLM 2 SMD 18 G is an 18-position header connector designed for surface mount installation. It features a 0.050 inch (1.27 mm) pitch and utilizes gold-plated contacts to ensure reliable signal transmission. The component is engineered for compatibility with male headers, providing a secure interconnection solution for printed circuit boards.

Headers, Receptacles, Female Sockets Feature Summary

• Precision-engineered surface mount design for stable PCB integration
• Gold-plated contact surfaces for enhanced conductivity and corrosion resistance
• Optimized geometry for compatibility with specific male header series

Headers, Receptacles, Female Sockets Applications

• Surface mount assembly on printed circuit boards
• Interconnection with compatible male header connectors
• Signal routing in compact electronic modules

Headers, Receptacles, Female Sockets Procurement Notes

Verify the exact part number against manufacturer documentation to confirm pin count and pitch specifications. Ensure that the selected variant matches the required surface mount orientation and mating header type. Cross-reference official datasheets for mechanical dimensions and thermal ratings before finalizing procurement orders.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a 1.27 mm pitch surface mount header is required for high-reliability connections. Confirm compatibility with the intended mating male header series to ensure proper engagement. Evaluate space constraints on the PCB layout to accommodate the surface mount footprint and adjacent components during assembly.

Headers, Receptacles, Female Sockets Part Context

This component belongs to the BLM 2 SMD series of header connectors manufactured by Fischer Elektronik. The series provides various position options and mounting configurations for electronic interconnect applications. The specific model offers a fixed 18-position configuration tailored for surface mount technology implementations.