BP706N

Overview

The BP706N is a non-metallic backplate designed for use with Hoffman APO series enclosures. It serves as a mounting plate for the 7.32-inch by 5.94-inch APOA1 enclosure model. This component facilitates the organization and secure attachment of internal electrical components within the specified enclosure dimensions.

Feature Summary

• Constructed from non-metallic material to provide electrical insulation and corrosion resistance.
• Engineered specifically for compatibility with 7.32 x 5.94 inch APO series enclosures.

Applications

• Mounting internal components within APOA1 enclosures
• Structural support for electrical panel assembly
• Insulation backing for control box installations

Procurement Notes

Verify that the target enclosure matches the 7.32 x 5.94 inch APOA1 specification before purchase. Confirm that the non-metallic construction aligns with project requirements regarding grounding or shielding needs, as this part does not provide conductive properties.

Selection Notes

Select the BP706N only when utilizing the specific 7.32 x 5.94 inch APO enclosure size. Ensure that the application does not require metallic shielding or grounding capabilities inherent to metal backplates. Validate that the non-metallic composition meets environmental and safety standards for the intended installation site.

Part Context

This component belongs to the nVent HOFFMAN APO enclosure accessory line. It functions as a replacement or supplementary mounting surface for modular industrial control enclosures. The part supports the structural integrity of internal wiring and device placement within the designated plastic enclosure housing.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Verify exact dimensional compatibility with existing APOA1 enclosures if sourcing alternatives.