BZX84-C10-QVL

Single Zener Diodes Overview

The Nexperia BZX84-C10-QVL is a low-power voltage regulator diode housed in a SOT-23 (TO-236AB) surface-mounted plastic package. It belongs to the BZX84-Q series, which offers nominal working voltages from 2.4 V to 75 V with approximately ±5% tolerance. The device features a total power dissipation of 250 mW and a non-repetitive peak reverse power dissipation of 40 W. Qualified according to AEC-Q101, it supports junction temperatures up to 150 °C and storage temperatures from -65 °C to +150 °C.

Single Zener Diodes Feature Summary

• AEC-Q101 qualified for automotive applications
• Low-power operation with 250 mW total dissipation
• Small SOT-23 surface-mount package

Single Zener Diodes Applications

• General regulation functions

Single Zener Diodes Procurement Notes

Verify the specific ordering suffix against the manufacturer's current documentation to ensure correct packaging and marking codes. Confirm that the component meets all required environmental and reliability standards for the intended application before finalizing procurement decisions.

Single Zener Diodes Selection Notes

Select this component for circuits requiring precise voltage regulation within the E24 range. Ensure the operating current remains within specified limits to maintain the ±5% tolerance. Consider thermal resistance characteristics when designing PCB layouts to manage heat dissipation effectively under maximum load conditions.

Single Zener Diodes Part Context

This part is part of the BZX84-Q series, a family of low-power Zener diodes designed for general-purpose voltage regulation. The series includes multiple breakdown voltages and tolerance grades, providing flexibility for various electronic design requirements while maintaining consistent package dimensions and electrical characteristics across the lineup.

Single Zener Diodes Replacement Considerations

Compatible substitutes include other BZX84-Q series variants with matching voltage ratings and tolerances. Verify pinout compatibility and thermal performance when replacing with components from different manufacturers or alternative series within the same package type.