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CD4511BF3A is listed in the Display Drivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is CMOS BCD-TO-7-SEGMENT LED LATCH. Review the specifications below when checking this part for your BOM.
The CD4511BF3A is a CMOS BCD-to-7-segment latch decoder driver manufactured by Texas Instruments. It operates within a supply voltage range of 3 V to 18 V and features a propagation delay time of 420 ns. The device provides seven output lines for driving display segments and accepts four input lines for binary coded decimal data. It is housed in a 16-lead hermetic dual-in-line ceramic package (CDIP-16) with an F3A suffix, designed for through-hole mounting. The component supports a maximum dissipation power of 500 mW and functions reliably across an operating temperature range from -55 °C to +125 °C.
Verify the F3A suffix confirms the use of a hermetic dual-in-line ceramic package rather than plastic variants. Ensure the application environment requires the specified wide temperature range and radiation hardness associated with military-grade specifications. Confirm that the through-hole mounting style aligns with the target PCB design constraints before finalizing the order.
Select this component when a hermetically sealed package is required for harsh environments or high-reliability applications. The CD4511BF3A is suitable for designs needing robust latch functionality and direct segment driving capabilities without external buffering. Consider the physical dimensions of the CDIP-16 package to ensure compatibility with existing board layouts and assembly processes.
This part belongs to the CD4511B series of CMOS logic devices produced by Texas Instruments. The series includes various package options such as plastic DIP and SOIC formats, but the BF3A variant specifically denotes the military-grade ceramic construction. It serves as a standard interface between digital logic circuits and visual display elements in critical systems.
The CD4511BE offers similar electrical characteristics but utilizes a plastic DIP-16 package instead of hermetic ceramic. Verify if the environmental sealing provided by the F3A suffix is strictly necessary for the specific deployment scenario.
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