CTCB0805F-401S

Chip Ferrite Bead Overview

The CTCB0805F-401S is a multilayer ferrite chip bead from Central Technologies, designed for surface-mount applications. It provides an impedance of 400 Ohms at a frequency of 100 MHz. The component supports a maximum current rating of 300 mA and features a low DC resistance of 300 milliohms. It operates within a temperature range of -55°C to +125°C. The device utilizes a 0805 (2012 Metric) package format.

Chip Ferrite Bead Feature Summary

• Multilayer construction for compact surface-mount integration
• High impedance characteristics effective at 100 MHz
• Wide operating temperature range for diverse environments

Chip Ferrite Bead Applications

• Signal line noise suppression
• Power supply filtering
• EMI reduction in high-frequency circuits

Chip Ferrite Bead Procurement Notes

Verify the specific datasheet version for the CTCB0805F-401S to confirm electrical tolerances and packaging details. Ensure compatibility with standard SMD reflow processes. Cross-reference manufacturer specifications against application requirements to validate current handling and impedance performance under actual operating conditions.

Chip Ferrite Bead Selection Notes

Select this component when a 400 Ohm impedance at 100 MHz is required for noise attenuation. Consider the 300 mA current limit and 300 milliohm DC resistance for power integrity. The 0805 footprint suits space-constrained designs requiring robust EMI control across a wide thermal range.

Chip Ferrite Bead Part Context

This part belongs to the CTCBF series of multilayer ferrite beads by Central Technologies. These components are engineered for high-density PCB layouts. The series offers various impedance values tailored for different frequency suppression needs while maintaining consistent physical dimensions for standardized assembly processes.

Chip Ferrite Bead Replacement Considerations

Consult official substitution lists for equivalent impedance and current ratings. Verify that alternative parts match the 0805 package and 100 MHz impedance profile. Ensure thermal and electrical specifications align with the original design constraints before implementation.