CTP250250

Overview

The Blackburn CTP250250 is a copper E-Z-Ground compression grounding C-tap connector designed for direct burial applications. It serves as a safe and efficient alternative to exothermic welding products. The unit accommodates a main or run conductor size of 3/0 AWG to 250 kcmil and provides a tap connection for conductors ranging from 3/0 AWG to 250 kcmil. Constructed from copper, it features a C-shape design suitable for stranded conductors.

Feature Summary

• Designed specifically for direct burial environments
• Provides a safe and efficient alternative to exothermic welding
• Constructed from copper material for durability

Applications

• Direct burial grounding connections
• Grounding system installations requiring C-tap configuration
• Replacement for exothermic welding in specific grounding scenarios

Procurement Notes

Verify the part number CTP250250 against official Blackburn or ABB documentation to ensure authenticity. Confirm that the required conductor sizes match the specified 3/0 AWG to 250 kcmil range for both main and tap positions. Ensure the application environment supports direct burial requirements as stated in the manufacturer's technical specifications.

Selection Notes

Select this component when a direct burial grounding solution is required that avoids the complexities of exothermic welding. It is appropriate for systems needing a C-tap configuration with compatible copper stranded conductors within the specified gauge range. Ensure compatibility with existing grounding infrastructure before procurement.

Part Context

This connector belongs to the Blackburn E-Z-Ground series, which focuses on providing reliable grounding solutions. The CTP series represents compression connectors designed for robust performance in underground applications. This specific model addresses the need for secure electrical connections in grounding networks without using traditional welding methods.

Replacement Considerations

Officially recommended replacements include TBM14M, 13100A, and TBM15I models. Verify dimensional and electrical compatibility with these substitutes before implementation to ensure system integrity.