CY7C1513AV18-167BZC

Memory IC Overview

The CY7C1513AV18-167BZC is a 72-Mbit QDR-II SRAM with a 4M x 18 organization. It supports a maximum operating frequency of 167 MHz and operates within a core voltage range of 1.7 V to 1.9 V. The device utilizes a 165-ball FBGA package measuring 15 x 17 x 1.4 mm. Maximum operating current at this speed is 615 mA.

Memory IC Feature Summary

• QDR-II architecture with separate independent read and write data ports for concurrent transactions
• Double Data Rate interfaces on both ports transferring data at twice the clock frequency
• Four-word burst architecture reducing address bus frequency requirements
• Echo clocks (CQ and CQ) provided to simplify data capture in high-speed systems

Memory IC Applications

• High-bandwidth networking equipment
• Telecommunications infrastructure
• Data acquisition systems
• Industrial control applications

Memory IC Procurement Notes

Verify component authenticity through authorized Infineon distributors or certified partners. Confirm RoHS compliance status as indicated by the suffix, noting that specific ordering variants may differ in lead-free characteristics. Validate package dimensions against the 165-ball FBGA specification before integration into PCB designs.

Memory IC Selection Notes

Select this model for applications requiring simultaneous read and write operations without bus turnaround delays. Ensure system design accommodates the 1.8V core voltage and 1.7V to 1.9V supply range. Verify that the host controller supports the required DDR interface timing and echo clock synchronization for optimal performance at 167 MHz.

Memory IC Part Context

This component belongs to the Cypress/Infineon QDR-II family of synchronous pipelined SRAMs. It shares architectural similarities with the CY7C1511AV18, CY7C1526AV18, and CY7C1515AV18, differing primarily in memory density and data width configurations while maintaining the same 165-ball FBGA footprint and interface protocols.

Memory IC Replacement Considerations

Direct pin-compatible substitutes include other members of the CY7C15xxAV18 series such as the CY7C1511AV18, CY7C1526AV18, and CY7C1515AV18, provided the system can accommodate differences in memory organization and data width.

Memory IC FAQ

How does the device handle concurrent read and write operations?

The QDR-II architecture provides separate independent read and write ports, allowing concurrent transactions. Addresses are latched on alternating rising edges of the input clock, enabling simultaneous access without bus contention.

What is the function of the DOFF pin?

The DOFF pin controls the Delay Lock Loop (DLL). Connecting it to ground disables the DLL, causing the device to operate in QDR-I mode with one-cycle read latency and longer access times.

How is output impedance matched in this SRAM?

An external resistor (RQ) must be connected between the ZQ pin and ground. The value should be five times the intended line impedance, typically between 175 Ω and 350 Ω, to tune the output drivers.