Telecom CYP15G0101DXB-BBC product image

CYP15G0101DXB-BBC

  • Description:IC TELECOM INTERFACE 100TBGA
  • Series:HOTlink II™

SKU:2c4b03ce3ec6 Category: Brand:

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CYP15G0101DXB-BBC is listed in the Telecom range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC TELECOM INTERFACE 100TBGA. Review the specifications below when checking this part for your BOM.

Telecom specifications for CYP15G0101DXB-BBC

  • Description:IC TELECOM INTERFACE 100TBGA
  • Series:HOTlink II™
  • Mfr:Infineon Technologies
  • Package:Tray
  • Function:Transceiver
  • Interface:LVTTL
  • Number of Circuits:-
  • Voltage - Supply:3.135V ~ 3.465V
  • Current - Supply:390mA
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:100-LBGA
  • Supplier Device Package:100-TBGA (11x11)
  • Power (Watts):-
  • Grade:-
  • Qualification:-

Telecom datasheet and documents for CYP15G0101DXB-BBC

CYP15G0101DXB-BBC

Telecom Overview

The CYP15G0101DXB is a single-channel HOTLink II transceiver manufactured by Infineon Technologies. It supports signaling speeds from 195 to 1500 MBaud and operates on a single 3.3 V supply with typical power consumption of 1.25 W. The device features an embedded 8B/10B encoder/decoder, selectable parity check/generate, and MultiFrame receive framer for byte alignment. It utilizes dual differential PECL-compatible serial inputs and outputs, internal PLLs, and provides synchronous LVTTL parallel I/O interfaces in a 100-ball BGA package.

Telecom Feature Summary

  • Supports compliant standards including ESCON, DVB-ASI, Fibre Channel, Gigabit Ethernet, CPRI, SMPTE 259M, and SMPTE 292M.
  • Integrates selectable 8B/10B encoding/decoding and multi-byte framing capabilities for data alignment.
  • Features internal phase-locked loops eliminating the need for external PLL components.
  • Includes built-in self-test (BIST) hardware for at-speed link testing and per-channel link quality indicators.

Telecom Applications

  • Interconnecting backplanes on switches and routers
  • Base-station communications systems
  • Server interconnect architectures
  • Video transmission systems

Telecom Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm datasheet revision *M specifications match design requirements. Ensure ESD protection protocols are followed during handling due to humidity sensitivity classification. Validate pinout compatibility with target PCB layout before integration.

Telecom Selection Notes

Select this model for point-to-point high-speed serial links requiring up to 1500 MBaud throughput. Choose based on required interface clocking options and specific standard compliance needs such as SMPTE or CPRI. Consider the 100-ball BGA package constraints and thermal management for 1.25 W dissipation when designing the system environment.

Telecom Part Context

This component belongs to the second-generation HOTLink family, extending previous generations with higher data rates and enhanced integration. It maintains serial-link compatibility with other HOTLink devices while offering improved performance for demanding telecommunications and video applications.

Telecom Replacement Considerations

The CYV15G0101DXB is the SMPTE-compliant variant of this device. Verify if SMPTE 259M and 292M pathological test compliance is required for the application to determine between the CYP and CYV suffixes.

CYP15G0101DXB-BBCCYP15G0101DXB-BBC

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