D2516AN9EXGXN-TU

Memory IC Overview

The Kingston Technology D2516AN9EXGXN-TU is a 4 Gbit DDR4 SDRAM component organized as 256M words by 16 bits. It utilizes a 96-ball FBGA package and operates at a maximum data rate of 3200 Mbps with a JEDEC speed bin of 22-22-22. The device requires a VDD supply voltage of 1.2V ± 0.06V and a VPP activating power supply of 2.5V (+0.25V/-0.125V). It supports an operating case temperature range from 0°C to +95°C.

Memory IC Feature Summary

• Supports Pseudo Open Drain (POD) interface with differential clock inputs and bi-directional differential data strobes for high-speed data transfer.
• Features eight internal banks divided into two bank groups, enabling independent CAS to CAS latency access within the same or different bank groups.
• Includes dynamic On-Die Termination (ODT) with switchable RTT_PARK and RTT_NOM states controlled by the ODT pin.

Memory IC Applications

• High-performance computing systems requiring fast memory bandwidth
• Server and workstation memory modules
• Graphics processing units (GPUs)
• Networking equipment

Memory IC Procurement Notes

Verify the specific ordering suffix TU against manufacturer documentation to confirm environmental compliance and package details. Ensure that system designs account for the required VPP voltage level and the specified refresh intervals, particularly when operating in the extended temperature range above 85°C. Confirm compatibility with the host controller's support for DDR4-3200 speeds and POD signaling.

Memory IC Selection Notes

Select this component for applications demanding high bandwidth and low latency within a compact footprint. The x16 organization suits wide data bus architectures. Consider the thermal management requirements for operation up to 95°C case temperature. Verify that the design supports the necessary ZQ calibration and mode register settings for optimal performance and signal integrity.

Memory IC Part Context

This part belongs to the Kingston D2516 series of DDR4 SDRAMs. It shares the 96-ball FBGA package and 4Gbit density with other variants in the family but differs in speed grade and temperature rating. The 'A' designation indicates the DDR4 product family with 1.2V operation.

Memory IC Replacement Considerations

Check for parts with identical organization (256Mx16), package (96-FBGA), and speed grade (DDR4-3200). Verify pinout compatibility and electrical specifications before substitution.