DAP202UMFHTL

Diode Arrays Overview

The DAP202UMFHTL is a silicon epitaxial planar switching diode in the UMD3F surface-mount package. It supports an 80V repetitive reverse voltage and 100mA average rectified forward current. Key electrical parameters include a maximum forward voltage of 1.2V at 100mA, a reverse current of 0.1µA at 70V, and a capacitance of 3.5pF at 6V. The device features a fast reverse recovery time of 4.0ns and withstands a 4A surge current. It operates within a junction temperature range up to 150°C and meets AEC-Q101 automotive qualification standards.

Diode Arrays Feature Summary

• High-speed switching capability with low reverse recovery time for efficient signal processing
• Compact small mold flat lead type construction suitable for space-constrained designs
• Automotive-grade reliability compliant with AEC-Q101 qualification standards

Diode Arrays Applications

• High speed switching circuits
• Automotive electronic modules requiring qualified components
• General purpose signal rectification applications

Diode Arrays Procurement Notes

Verify the specific ordering suffix HTL against the manufacturer's latest documentation to confirm tape and reel specifications. Confirm availability status as some variants may be subject to production lifecycle changes. Ensure storage conditions adhere to humidity barrier bag requirements to maintain solderability prior to mounting.

Diode Arrays Selection Notes

Select this component when high-speed switching performance is required alongside automotive reliability standards. The UMD3F package offers a compact footprint for surface-mount assembly. Verify that the 80V reverse voltage rating aligns with the circuit's peak inverse voltage requirements and that the 100mA current capacity suits the load application.

Diode Arrays Part Context

This part belongs to ROHM Semiconductor's DAP202 series of switching diodes designed for general-purpose and automotive applications. The series utilizes silicon epitaxial planar technology to ensure consistent performance. The UMD3F package variant provides a standardized surface-mount form factor compatible with automated pick-and-place manufacturing processes.

Diode Arrays Replacement Considerations

Consult official substitution guides for equivalent parts with matching pinouts and electrical ratings. Verify package compatibility and thermal characteristics before implementing any alternative components in existing designs.