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DG445DYZ-T is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SWITCH SPST-NOX4 85OHM 16SOIC. Review the specifications below when checking this part for your BOM.
The DG445DYZ-T is a monolithic quad single-pole single-throw (SPST) CMOS analog switch manufactured by Renesas Electronics Corporation. It features four independent switches in a 16-pin SOIC-Narrow package, designed for high-performance signal routing. The device supports single supply voltages from 5 V to 34 V or dual supplies from ±5 V to ±20 V. Key electrical parameters include a maximum on-resistance of 85 Ohms, a maximum power supply current of 1 µA, and a maximum DC switch current of 30 mA. Switching times are specified with a maximum turn-on time of 250 ns and a maximum turn-off time of 210 ns. The component operates within a temperature range of -40°C to +85°C.
Verify the manufacturer marking and lot code against official Renesas documentation to confirm authenticity. Ensure the SOIC-Narrow-16 package dimensions match your PCB footprint requirements. Check for moisture sensitivity level compliance if the component has been stored in non-controlled environments prior to assembly.
Select this component when a quad SPST configuration is required with moderate on-resistance specifications. Compare against the DG411 series if lower on-resistance or faster switching speeds are necessary for the specific application. Ensure the operating voltage range aligns with the system's power supply capabilities.
This part belongs to the DG445 series of improved quad SPST analog switches. It serves as a successor to earlier CMOS switch technologies, offering enhanced performance characteristics such as reduced charge injection and latch-up immunity. The series is widely used in industrial and commercial electronic equipment requiring reliable analog signal switching.
The DG445DVZ is a pin-compatible alternative available in a TSSOP-16 package. Verify that the package width and thermal characteristics of the replacement suit the existing board layout constraints before substitution.
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