DSA70C150HB

Diode Arrays Overview

The DSA70C150HB is a high-performance Schottky rectifier from IXYS, housed in a TO-247AD package. It features a dual common cathode configuration with a maximum repetitive peak reverse voltage of 150 V and an average forward current rating of 35 A per diode. The device exhibits a typical forward voltage of 740 mV at rated current and supports a non-repetitive peak surge current of 300 A. Operating temperatures range from -55 °C to +175 °C junction temperature.

Diode Arrays Feature Summary

• Extremely low switching losses due to soft recovery characteristics
• Very low forward voltage for improved efficiency
• Low reverse leakage current (Irm) values
• Improved thermal behavior for robust operation

Diode Arrays Applications

• High-frequency power supplies
• DC-DC converters
• Uninterruptible Power Supplies (UPS)
• Free-wheeling applications in motor drives

Diode Arrays Procurement Notes

Verify the specific suffix 'HB' against the manufacturer's latest datasheet to confirm pinout and thermal interface specifications. Ensure the procurement channel provides original manufacturer documentation to validate authenticity and compliance with RoHS standards before finalizing orders.

Diode Arrays Selection Notes

Select this component for circuits requiring low conduction losses and fast switching speeds. The TO-247AD package facilitates effective heat dissipation. Compare the 150 V rating and 35 A current capacity against circuit requirements to ensure adequate safety margins for peak loads and transient voltages.

Diode Arrays Part Context

This part belongs to the IXYS HiPerFRED or similar high-efficiency diode series, designed for hard-switching applications. It serves as a replacement for older generation Schottky diodes where reduced switching noise and lower thermal resistance are critical for system reliability and compact design constraints.

Diode Arrays Replacement Considerations

Direct substitutes must match the 150 V reverse voltage, 35 A current rating, and TO-247AD package. Verify that alternative parts maintain comparable soft recovery characteristics and forward voltage drops to prevent thermal runaway or efficiency loss in existing designs.