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DSEE29-12CC is listed in the Diode Arrays range at ChipApex. The manufacturer field lists IXYS. Its product description is DIODE ARR GP 600V 30A ISOPLUS220. Review the specifications below when checking this part for your BOM.
The DSEE29-12CC is a high-performance fast recovery diode from the HiPerDynFRED™ series, manufactured by IXYS. It features a dual series configuration with a center tap in an ISOPLUS220 package. Key electrical parameters include a maximum repetitive reverse voltage of 1200 V and a maximum average forward rectifier current of 30 A. The device exhibits a maximum reverse recovery time of 35 ns and a typical forward voltage of 1.27 V at 30 A. It operates within a junction temperature range of -55°C to +175°C.
Verify the specific datasheet version when sourcing, as some distributor descriptions may incorrectly list the reverse voltage as 600V instead of the confirmed 1200V. Confirm compliance with RoHS standards and lead times, as production cycles can vary. Ensure the ISOPLUS220 package dimensions match your PCB layout requirements before finalizing orders.
Select this component for applications requiring fast switching speeds and low reverse recovery charge. The dual series configuration with a center tap makes it suitable for bridge or half-bridge topologies. Consider the thermal resistance of 0.90 K/W for heat sink design. Ensure the operating voltage does not exceed the 1200V peak repetitive reverse limit.
This part belongs to the DSEE Series and HiPerDynFRED™ product line, designed for efficient power conversion. It represents IXYS' expertise in epitaxial technology for fast recovery applications. The ISOPLUS220 package provides robust mechanical stability and effective heat dissipation for through-hole mounting in industrial power electronics.
Direct substitutes are not explicitly listed in the provided documentation. When evaluating alternatives, prioritize devices with matching 1200V rating, 30A current capacity, and similar reverse recovery times. Verify that the replacement package is compatible with existing mounting infrastructure.
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