Diode Arrays DSEI2X31-06P product image

DSEI2X31-06P

  • Description:DIODE MODULE GP 600V 30A ECOPAC1
  • Series:-

SKU:b3635b7cd8d7 Category: Brand:

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DSEI2X31-06P is listed in the Diode Arrays range at ChipApex. The manufacturer field lists IXYS. Its product description is DIODE MODULE GP 600V 30A ECOPAC1. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for DSEI2X31-06P

  • Description:DIODE MODULE GP 600V 30A ECOPAC1
  • Series:-
  • Mfr:IXYS
  • Package:Box
  • Diode Configuration:2 Independent
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):600 V
  • Current - Average Rectified (Io) (per Diode):30A
  • Voltage - Forward (Vf) (Max) @ If:1.6 V @ 30 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):50 ns
  • Current - Reverse Leakage @ Vr:100 µA @ 600 V
  • Operating Temperature - Junction:-40°C ~ 150°C
  • Mounting Type:Chassis Mount
  • Package / Case:ECO-PAC1
  • Supplier Device Package:ECO-PAC1
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for DSEI2X31-06P

DSEI2X31-06P

Diode Arrays Overview

The IXYS DSEI2X31-06P is a Fast Recovery Epitaxial Diode (FRED) module featuring two independent diodes in a single package. It offers a peak repetitive reverse voltage of 600 V and a continuous forward current rating of 30 A per diode at 85°C case temperature. The device exhibits a maximum reverse recovery time of 50 ns and a peak reverse recovery current of 11 A. Electrical isolation is rated at 3000 V~ for one second. The component utilizes a planar passivated chip design with leads suitable for printed circuit board soldering, housed in a screw-mountable configuration.

Diode Arrays Feature Summary

  • Dual independent FRED diodes integrated into a single compact package
  • High electrical isolation capability of 3000 V~
  • Planar passivated chip construction for reliability
  • Leads designed for compatibility with PC board soldering

Diode Arrays Applications

  • Antiparallel diode for high frequency switching devices
  • Free wheeling diode in converters and motor control circuits
  • Rectifiers in switch mode power supplies (SMPS)
  • Snubber diode applications
  • Inductive heating and melting systems

Diode Arrays Procurement Notes

Verify the specific ordering suffix to confirm pinout and isolation ratings match the application requirements. Ensure thermal management solutions align with the specified junction temperature limits and power dissipation characteristics. Confirm that mounting torque specifications are strictly adhered to during installation to maintain mechanical integrity and thermal performance.

Diode Arrays Selection Notes

Select this component when dual isolated fast recovery diodes are required within a constrained volume. The low noise switching characteristic makes it suitable for sensitive electromagnetic environments. Evaluate the thermal resistance parameters against the system's heat sink capabilities to ensure operation remains within the maximum junction temperature limits under expected load conditions.

Diode Arrays Part Context

This part belongs to the DSEI2X31 series from IXYS, which focuses on high-efficiency power rectification. The series is engineered for applications demanding rapid switching speeds and robust thermal cycling performance. The design emphasizes space savings and weight reduction compared to discrete component implementations while maintaining high reliability standards for industrial power electronics.

Diode Arrays Replacement Considerations

Cross-reference with other DSEI2X31 variants such as DSEI2X31-06A or DSEI2X31-10B if voltage or current ratings differ from project specifications. Verify that any substitute maintains the same 3000 V~ isolation rating and compatible mounting dimensions to ensure seamless integration without modifying the existing PCB layout or chassis structure.

DSEI2X31-06PDSEI2X31-06P

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