Diode Arrays DUR1040CT product image

DUR1040CT

$2.13
  • Description:DIODE ARRAY GP 400V 5A TO-220AB
  • Series:DUR

SKU:d4c3ec32293a Category: Brand:

  
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DUR1040CT is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Littelfuse Inc.. Its product description is DIODE ARRAY GP 400V 5A TO-220AB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for DUR1040CT

  • Description:DIODE ARRAY GP 400V 5A TO-220AB
  • Series:DUR
  • Mfr:Littelfuse Inc.
  • Package:Tube
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):400 V
  • Current - Average Rectified (Io) (per Diode):5A
  • Voltage - Forward (Vf) (Max) @ If:1.3 V @ 5 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):45 ns
  • Current - Reverse Leakage @ Vr:30 µA @ 100 V
  • Operating Temperature - Junction:-55°C ~ 150°C
  • Mounting Type:Through Hole
  • Package / Case:TO-220-3
  • Supplier Device Package:TO-220AB
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for DUR1040CT

DUR1040CT

Diode Arrays Overview

The Littelfuse DUR1040CT is an ultrafast recovery rectifier featuring a common cathode configuration with two elements housed in a TO-220AB package. It supports a peak inverse voltage of 400V and provides an average forward current of 5A per leg, totaling 10A for the device. The component exhibits a maximum reverse recovery time of 45ns and a forward voltage drop of 1.3V at 5A. It operates within a junction temperature range of -55°C to +150°C.

Diode Arrays Feature Summary

  • Ultra-fast switching capability with low reverse recovery time
  • Low reverse leakage current across operating temperatures
  • High surge current handling capacity
  • Lead-free E3 terminal finish compliant with IPC/JEDEC standards

Diode Arrays Applications

  • Output rectifiers in switch mode power supplies (SMPS) and DC to DC converters
  • Free-wheeling or boost diodes in converters and motor control circuits
  • Anti-parallel diodes for high-frequency switching devices such as IGBTs
  • Uninterruptible Power Supplies (UPS)
  • Inductive heating and melting equipment

Diode Arrays Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to confirm packaging details and compliance status. Ensure the procurement documentation matches the exact part number designation to avoid discrepancies in thermal resistance or electrical ratings. Confirm that the received components align with the specified TO-220AB case style and marking requirements.

Diode Arrays Selection Notes

Select this component for high-frequency power switching applications requiring fast recovery characteristics. Evaluate the thermal management requirements based on the junction-to-case thermal resistance value. Consider the 400V blocking voltage and 5A per leg current rating when designing output stages for SMPS or DC-DC converters. Verify compatibility with lead-free reflow soldering processes if required by the assembly specifications.

Diode Arrays Part Context

This device belongs to the Littelfuse DUR series of ultrafast recovery rectifiers designed for commercial applications. The series emphasizes low reverse recovery time, high-temperature stability, and low forward voltage drop. It serves as a specialized solution for efficient power conversion where rapid switching speeds are critical to minimizing energy loss and improving overall system efficiency.

Diode Arrays Replacement Considerations

Consult official Littelfuse cross-reference documentation for verified substitute part numbers. Do not assume functional equivalence with other manufacturers' ultrafast rectifiers without verifying electrical parameters and pin configurations.

Diode Arrays FAQ

What is the maximum reverse recovery time for the DUR1040CT?

The maximum reverse recovery time is 45ns under specified test conditions.

Is the DUR1040CT suitable for lead-free soldering processes?

Yes, the Pb-free E3 designation indicates that the second-level interconnect is lead-free and the terminal finish material is tin, making it compatible with lead-free reflow soldering.

What is the thermal resistance from junction to case?

The typical thermal resistance from junction to case is 3.5 °C/W during DC operation.

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