EP1S40B956C6N

Field Programmable Gate Array Overview

The EP1S40B956C6N is a Stratix I Field Programmable Gate Array (FPGA) manufactured by Altera. It features 39,872 logic elements and supports up to 422 user I/Os within a 956-pin FineLine BGA package. The device integrates 1,728 Kbits of embedded memory blocks and includes 18 DSP blocks for arithmetic operations. It operates with core voltages typically ranging from 1.15V to 1.25V for the main logic and 2.5V for I/O interfaces. The component is designed for high-performance digital signal processing and complex system integration tasks.

Field Programmable Gate Array Feature Summary

• Contains 39,872 logic elements and 1,728 Kbits of embedded RAM
• Includes 18 dedicated 18x18 DSP blocks for hardware multiplication and accumulation
• Supports high-speed serial transceivers for communication protocols
• Available in a 956-pin FineLine BGA package suitable for dense board layouts

Field Programmable Gate Array Applications

• Prototyping Java System-on-Chip designs using AMBA bus architectures
• Digital signal processing in telecommunications infrastructure
• Complex control logic for industrial automation systems
• High-speed data acquisition and processing modules

Field Programmable Gate Array Part Context

This component belongs to the Stratix family, representing a high-end FPGA series from Altera prior to its acquisition by Intel. The 'EP' prefix denotes an early production or engineering sample variant, while 'S' indicates the Stratix architecture. The specific suffix 'C6N' identifies the speed grade and commercial temperature range classification. This part was widely used in research and development environments for validating complex digital designs before tape-out.

Field Programmable Gate Array FAQ

What is the primary logic capacity of the EP1S40B956C6N?

The device contains 39,872 logic elements, providing substantial programmable logic density for complex applications.

Does this FPGA include dedicated hardware for digital signal processing?

Yes, it integrates 18 DSP blocks capable of performing 18x18 bit multiplication and addition operations without consuming general logic resources.

What packaging type is used for this model?

It utilizes a 956-pin FineLine Ball Grid Array (BGA) package, which offers high pin count and thermal performance for surface-mount assembly.