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FDU8878 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is MOSFET N-CH 30V 11A/40A IPAK. Review the specifications below when checking this part for your BOM.
The FDU8878 is an N-Channel PowerTrench MOSFET manufactured by Fairchild Semiconductor. It features a drain-source voltage (Vdss) of 30 V and a continuous drain current (Id) of 40 A at 25°C ambient temperature. The device exhibits a maximum on-resistance (Rds On) of 15 mΩ when driven at 10 V gate-source voltage. It utilizes a TO-220-3 through-hole package with a maximum power dissipation rating of 110 W at case temperature. The component operates within a junction temperature range of -55°C to +175°C.
Verify the manufacturer status, as Fairchild Semiconductor was acquired by onsemi. Confirm whether the specific batch originates from original Fairchild inventory or subsequent onsemi production runs. Ensure the datasheet revision matches the required specifications. Check for RoHS compliance markings if environmental regulations apply to the final assembly. Validate the package type against the schematic footprint requirements.
Select this component for applications requiring a 30 V rated N-Channel MOSFET with high current handling in a through-hole package. Compare the 15 mΩ on-resistance against system conduction loss requirements. Evaluate the thermal resistance characteristics of the TO-220-3 package relative to the expected heat dissipation. Consider the gate charge parameters for driving circuit compatibility.
The FDU8878 belongs to the PowerTrench family of MOSFETs, designed for efficient power switching. Originally produced by Fairchild Semiconductor, the product line continues under onsemi following the corporate acquisition. This specific part represents a legacy through-hole solution compared to modern surface-mount alternatives in the same voltage class.
Consult official substitution lists for equivalents such as FDP8874 or FDD8878. Verify pinout compatibility and electrical parameter alignment before replacing. Note that package differences may require PCB redesign or mechanical adaptation.
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