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FMEN-2308 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Sanken Electric USA Inc.. Its product description is DIODE ARR SCHOTT 80V 15A TO2203. Review the specifications below when checking this part for your BOM.
The FMEN-2308 is an 80 V, 30 A Schottky diode manufactured by Sanken Electric. It features a TO220F-3L package with two internal chips. Key electrical parameters include a typical forward voltage drop of 0.725 V at 15 A and a maximum reverse leakage current of 300 µA at 80 V. The device supports a junction temperature range from -40 °C to 150 °C and has a thermal resistance (junction-to-case) of 4.0 °C/W.
Verify the specific ordering suffix against official documentation before procurement. Confirm that the bare lead frame meets environmental compliance requirements for your assembly process. Ensure heatsink mounting torque remains between 0.490 N·m and 0.686 N·m during installation to maintain mechanical integrity and thermal performance.
Select this component when designing systems requiring an 80 V rating and 30 A average forward current capability. Consider the 4.0 °C/W thermal resistance for heat sink calculations. Verify compatibility with high-frequency operation needs due to its Schottky barrier technology and optimized VF/IR characteristics.
This part belongs to Sanken Electric's Schottky diode lineup designed for general-purpose electronic equipment. It utilizes a TO220F-3L surface-mount compatible package. The device is intended for use in home appliances, office equipment, and telecommunications gear, subject to standard derating guidelines.
Consult official Sanken Electric documentation or authorized distributors for verified substitute part numbers. Do not assume cross-compatibility with other manufacturers' components without validating absolute maximum ratings and electrical characteristics.
The nonrepetitive peak reverse voltage is 80 V, and the surge forward current is rated at 150 A for a half-cycle sine wave positive side, 10 ms duration.
The FMEN-2308 consists of two internal chips configured within the single package.
Soldering with an iron should be performed at 350 °C for a maximum of 3.5 seconds, maintaining a distance of at least 1.5 mm from the product body.
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