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HCPL-060L-000E is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is OPTOISO 3.75KV OPN COLL 8SO TALL. Review the specifications below when checking this part for your BOM.
The HCPL-060L-000E is a high-speed, single-channel digital optocoupler from the Broadcom HCPL series. It integrates a GaAsP light-emitting diode with an integrated high-gain photo detector to provide reliable electrical isolation. The device features a data rate of 15 Mb/s and operates with a typical forward current of 10 mA. Key electrical parameters include a maximum forward voltage of 1.75 V, an isolation voltage of 3750 Vrms, and a reverse voltage rating of 5 V. Timing characteristics specify a typical rise time of 45 ns and a fall time of 20 ns. The component supports open-collector logic output and functions within a temperature range of -40°C to +85°C.
Verify the specific ordering suffix against official Broadcom documentation to ensure correct packaging and tape-and-reel specifications. Confirm that the selected variant matches the required operating temperature range and isolation voltage ratings for the target application environment. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and traceability before finalizing procurement orders.
Select this component when applications require high-speed digital isolation with a 15 Mb/s data rate capability. Ensure the design accommodates the 3.3V or 5V logic levels supported by the integrated gate structure. Verify that the SOIC-8 package dimensions fit the PCB layout constraints and that the thermal dissipation requirements align with the specified power loss limits under maximum operating conditions.
This device belongs to the HCPL series of high-speed optocouplers manufactured by Broadcom Limited. The series is designed for applications demanding fast signal transfer across isolated boundaries while maintaining compact form factors. The HCPL-060L-000E specifically utilizes a surface-mount SOIC-8 package to facilitate automated assembly processes in modern electronic manufacturing environments.
Public confirmed substitute part numbers are not available in the provided source material.
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