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HCPL0630 is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists onsemi. Its product description is OPTOISO 3.75KV 2CH OPEN COLL 8SO. Review the specifications below when checking this part for your BOM.
The HCPL-0630 is a dual-channel high-speed optocoupler manufactured by Broadcom Limited (formerly Avago/Agilent). It integrates a GaAsP light-emitting diode with an integrated high-gain photo detector to form an optically coupled logic gate. The device features a data rate of 10 Mb/s and supports an input forward current of 10 mA. Key electrical parameters include an isolation voltage of 3750 Vrms, a typical rise time of 24 ns, and a fall time of 10 ns. It operates within a temperature range of -40°C to +85°C and is available in an 8-pin SOIC surface-mount package.
Verify the manufacturer origin carefully, as the HCPL-0630 was originally developed by Agilent/Hewlett-Packard and later transferred to Avago/Broadcom. Ensure the specific suffix matches the required packaging format. Confirm RoHS compliance status and check for any obsolescence notices or PCN updates from the current manufacturer before finalizing procurement.
Select this component when a dual-channel solution with 10 Mb/s speed is required in a compact SOIC-8 package. It serves as a direct replacement for legacy HP/Agilent parts. Consider the HCPL-063L if a higher data rate of 15 Mb/s is needed, though it may have different timing characteristics. Ensure the application voltage does not exceed the 3750 Vrms isolation rating.
This part belongs to the HCPL series of high-speed optocouplers. It is functionally equivalent to the Fairchild Semiconductor FOD630 and the original Hewlett-Packard HP630. The device is widely used in industrial applications where reliable high-speed data transfer across isolation barriers is critical.
Direct substitutes include HCPL-063L (higher speed), HCPL-063A, and HCPL-063B. Cross-manufacturer equivalents include FOD630 (onsemi/Fairchild) and ILD630 (Infineon). Verify pinout compatibility and thermal performance when substituting.
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