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HERF1604G is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is DIODE ARRAY GP 300V 16A ITO220AB. Review the specifications below when checking this part for your BOM.
The HERF1604G is a glass passivated high-efficiency dual rectifier manufactured by Taiwan Semiconductor. It features a common cathode configuration with two silicon elements housed in an isolated TO-220AB package. The device supports a maximum repetitive peak reverse voltage of 400V and a continuous forward current of 16A. Key electrical parameters include a maximum non-repetitive peak forward surge current of 125A, a typical forward voltage of 1.7V, and a maximum reverse current of 10µA. The component operates within a junction temperature range of -55°C to +150°C and complies with RoHS directives.
Verify the specific suffix codes on the ordering information to confirm package type and compliance status. Ensure the selected variant matches the required voltage rating for the target circuit application. Confirm that the manufacturer documentation aligns with the requested pinout and thermal specifications before finalizing procurement orders.
Select this component when a dual common cathode configuration is required for high-current applications. The 16A rating suits medium-power conversion tasks. Verify that the 400V reverse voltage rating exceeds the peak inverse voltage expected in the circuit. Consider the TO-220AB package for through-hole mounting requirements and adequate thermal dissipation capabilities.
This part belongs to the HERF series of glass passivated high-efficiency rectifiers from Taiwan Semiconductor. The series offers various voltage ratings while maintaining consistent current handling capabilities. The HERF designation indicates a fast recovery characteristic suitable for high-frequency switching environments compared to standard rectifiers.
Cross-reference with other manufacturers offering 16A dual common cathode rectifiers in TO-220AB packages. Verify that substitute parts meet or exceed the 400V reverse voltage and 16A forward current specifications. Ensure thermal resistance and package dimensions are compatible with existing board layouts.
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