HFA70NC60C

Description：DIODE MODULE GP 600V 56A D61-8
Series：HEXFRED®

SKU:192be6c73f65 Category: Diode Arrays Brand: Vishay General Semiconductor - Diodes Division

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Product introduction

HFA70NC60C is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE MODULE GP 600V 56A D61-8. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for HFA70NC60C

Description：DIODE MODULE GP 600V 56A D61-8
Series：HEXFRED®
Mfr：Vishay General Semiconductor - Diodes Division
Package：Bulk
Diode Configuration：1 Pair Common Cathode
Technology：Standard
Voltage - DC Reverse (Vr) (Max)：600 V
Current - Average Rectified (Io) (per Diode)：56A (DC)
Voltage - Forward (Vf) (Max) @ If：1.5 V @ 35 A
Speed：Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)：110 ns
Current - Reverse Leakage @ Vr：10 µA @ 600 V
Operating Temperature - Junction：-55°C ~ 150°C
Mounting Type：Chassis Mount
Package / Case：D-61-8
Supplier Device Package：D-61-8
Grade：-
Qualification：-

Diode Arrays datasheet and documents for HFA70NC60C

HFA70NC60C

Diode Arrays Overview

The HFA70NC60C is a HEXFRED ultrafast soft recovery diode module manufactured by Vishay General Semiconductor - Diodes Division. It features a D-61-8 package with a maximum repetitive reverse voltage of 600 V and a continuous forward current rating of 56 A at 25°C case temperature. The device exhibits a typical reverse recovery time of 30 ns, peak reverse recovery current of 6.0 A, and reverse recovery charge of 210 nC under standard test conditions.

Diode Arrays Feature Summary

Optimized for high-frequency power conditioning systems to reduce switching losses and electromagnetic interference.
Soft recovery characteristics eliminate the need for snubber circuits in most applications.
Extensive characterization of recovery parameters across varying current, temperature, and di/dt values simplifies loss calculations.

Diode Arrays Applications

High-frequency power converters
Motor drives
Applications where switching losses constitute a significant portion of total system losses

Diode Arrays Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm datasheet revision status and specific lot traceability requirements before procurement. Ensure thermal interface materials and mounting torque specifications align with the D-61-8 package mechanical constraints to maintain rated performance.

Diode Arrays Selection Notes

Select this component for designs requiring ultrafast recovery speeds and low reverse recovery charge to minimize EMI. Evaluate thermal management capabilities against the specified junction-to-case thermal resistance values. Consider the soft recovery profile for sensitive switching topologies where voltage spikes must be mitigated without external snubbers.

Diode Arrays Part Context

This part belongs to the HEXFRED series of ultrafast soft recovery diodes from Vishay. These devices are engineered specifically for high-efficiency power electronics applications. The D-61-8 package provides robust isolation and thermal dissipation suitable for baseplate mounting in industrial and automotive environments.