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HHM1523C1 is listed in the Balun range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is BALUN 880MHZ-960MHZ 50/100 0805. Review the specifications below when checking this part for your BOM.
The HHM1523C1 is an LTCC balun transformer manufactured by TDK Corporation, designed for signal conditioning in RF applications. It operates within a frequency range of 880 MHz to 960 MHz, centered around 880-960 MHz. The component provides impedance transformation between 50 Ohms and 100 Ohms. It features a maximum insertion loss of 1.1 dB and a minimum return loss of 10 dB. The phase difference is specified as 180° ±10°. Packaged in a 0805 (2012 metric) surface-mount case, it supports board mount installation. The device functions within an operating temperature range of -40°C to +85°C.
Verify component authenticity through authorized distributors due to end-of-life status. Confirm RoHS3 compliance and MSL level 1 handling requirements during storage. Check datasheet revisions for any specification updates prior to integration. Ensure supply chain stability as manufacturer discontinuation may affect long-term availability. Validate package dimensions against PCB footprint specifications before procurement.
Select this component when designing circuits requiring 50 to 100 Ohm impedance transformation in the 880-960 MHz range. Consider the 0805 package size for space-constrained layouts. Evaluate thermal performance within the -40°C to +85°C operating window. Assess insertion loss impact on system sensitivity. Verify compatibility with standard SMT assembly processes for reliable soldering.
Part of the HHM series of multilayer baluns from TDK Corporation. Utilizes Low-Temperature Co-fired Ceramic technology for compact RF solutions. Designed for high-volume production in wireless infrastructure and mobile devices. Complements other signal conditioning components in RF filter kits. Represents a specialized solution for balanced line interfacing in modern communication standards.
Consult official TDK documentation for confirmed substitute part numbers. No direct public substitutes are listed in available sources. Verify electrical parameter equivalence if considering alternative manufacturers. Ensure mechanical footprint compatibility for existing PCB designs.
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