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HSMP-3863-TR2G is listed in the RF Diode range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is RF DIODE PIN 50V SOT-363. Review the specifications below when checking this part for your BOM.
The HSMP-3863-TR2G is a surface mount PIN diode from the HSMP-386x series, manufactured by Broadcom Limited. It features a common anode configuration housed in an SOT-363 package. Key electrical specifications include a breakdown voltage of 50 V, a typical total capacitance of 0.20 pF at 1 MHz and 50 V reverse bias, and a typical series resistance of 1.5 Ω at 10 mA forward current. The device supports a maximum forward current of 1 A (1 µs pulse) and operates within a junction temperature range of -65°C to 150°C.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and check for relevant reliability documentation such as the Surface Mount PIN Reliability Data Sheet. Ensure proper handling precautions are taken to avoid static discharge damage during assembly and storage.
Select this part when a common anode topology is required for RF switching or attenuation. The SOT-363 package offers board space savings compared to larger packages. Consider the 0.20 pF capacitance for high-frequency applications and the 1.5 Ω series resistance for low-loss signal paths. Verify thermal management requirements against the specified thermal resistance values.
This component belongs to the HSMP-386x family of general-purpose PIN diodes designed for attenuator and switch applications. The series includes various configurations such as single, series, common cathode, and unconnected trio options within SOT-23, SOT-323, and SOT-363 packages. The HSMP-3863 specifically provides the common anode variant for circuit designs requiring shared anode connections.
HSMP-3860-TR2G
The datasheet lists a typical carrier lifetime of 500 ns for the HSMP-386x series.
No, a SPICE model is not available because SPICE does not provide for the key PIN diode characteristic of carrier lifetime.
The maximum soldering temperature is 260°C for 5 seconds, conforming to IPC/JEDEC J-STD-020C lead-free reflow profiles.
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