Memory IC IS61NVP51236B-200B3LI-TR product image

IS61NVP51236B-200B3LI-TR

$11.64
  • Description:IC SRAM 18MBIT PARALLEL 165TFBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)

SKU:9a4c23916792 Category: Brand:

  
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IS61NVP51236B-200B3LI-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC SRAM 18MBIT PARALLEL 165TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS61NVP51236B-200B3LI-TR

  • Description:IC SRAM 18MBIT PARALLEL 165TFBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tape & Reel (TR)
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, SDR
  • Memory Size:18Mbit
  • Memory Organization:512K x 36
  • Memory Interface:Parallel
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.375V ~ 2.625V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-TBGA
  • Supplier Device Package:165-TFBGA (13x15)
  • Access Time:3 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IS61NVP51236B-200B3LI-TR

IS61NVP51236B-200B3LI-TR

Memory IC Overview

The IS61NVP51236B-200B3LI-TR is a 18Mb synchronous static random-access memory (SRAM) device manufactured by ISSI. It features a memory organization of 512K x 36 bits and supports a maximum clock frequency of 200 MHz with a typical access time of 3.1 ns. The component operates within a supply voltage range of 3.135 V to 3.465 V, while utilizing 2.5 V I/O levels. It is housed in a 165-ball TFBGA package measuring 13x15 mm and is designed for surface mount technology applications.

Memory IC Feature Summary

  • Supports pipeline architecture for high-speed data processing
  • Features no-wait operation capability for efficient system integration
  • Provides parallel interface connectivity for standard bus architectures

Memory IC Applications

  • High-performance computing systems requiring fast data retrieval
  • Network infrastructure equipment demanding low latency
  • Industrial control systems operating under strict timing constraints

Memory IC Procurement Notes

Verify the specific suffix B3LI against the manufacturer's current datasheet to confirm pinout compatibility and electrical specifications. Ensure that the 165-ball TFBGA footprint matches the target PCB design. Confirm moisture sensitivity level handling requirements during assembly to prevent package damage. Cross-reference the 2.5V I/O requirement with the host system logic levels to ensure signal integrity.

Memory IC Selection Notes

Select this component when a wide data bus width of 36 bits is required alongside high clock speeds up to 200 MHz. It is suitable for designs needing synchronous SRAM with pipeline capabilities rather than flow-through access. Consider the 165-ball TFBGA package size constraints and thermal dissipation needs relative to the 240 mA maximum power consumption.

Memory IC Part Context

This part belongs to the IS61NLP/NVP series of synchronous SRAMs from ISSI. It shares architectural similarities with other members like the IS61NLP51236B but differs in specific interface or speed grades. The NVP designation typically indicates specific packaging or performance variations within the broader family of 18Mb synchronous memories.

Memory IC Replacement Considerations

Direct substitutes include the IS61NLP51236B-200B3LI-TR and IS61NVP51236B-200B3I-TR. Verify pin-to-pin compatibility and identical voltage tolerances before substitution.

IS61NVP51236B-200B3LI-TRIS61NVP51236B-200B3LI-TR
$11.64
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