Memory IC JS27HU4G08SDDA-25-SU product image

JS27HU4G08SDDA-25-SU

$4.02
  • Description:4G SLC NAND PKG 9x11mm 63FBGA
  • Series:parallel NAND
  • Mfr:Jeju Semiconductor Corp
  • Package:Bulk

SKU:0b9f5f64bec7 Category: Brand:

  
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JS27HU4G08SDDA-25-SU is listed in the Memory IC range at ChipApex. The manufacturer field lists Jeju Semiconductor Corp. Its product description is 4G SLC NAND PKG 9x11mm 63FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for JS27HU4G08SDDA-25-SU

  • Description:4G SLC NAND PKG 9x11mm 63FBGA
  • Series:parallel NAND
  • Mfr:Jeju Semiconductor Corp
  • Package:Bulk
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Memory IC datasheet and documents for JS27HU4G08SDDA-25-SU

JS27HU4G08SDDA-25-SU

Memory IC Overview

The JS27HU4G08SDDA-25-SU is a 4Gb (512MB) x8 interface NAND Flash memory from Jeju Semiconductor Corp, compliant with ONFI 1.0 specifications. It operates at a Vcc supply voltage of 2.7V to 3.6V and supports an industrial temperature range of -40°C to 85°C. The device features a page size of 2K bytes plus 128 spare bytes and a block size of 128K bytes plus 8K spare bytes. It utilizes a 63-ball FBGA package measuring 9.0 x 11.0 mm. Key performance metrics include a maximum random access time (tR) of 30us for sequential reads and a typical page program time of 300us.

Memory IC Feature Summary

  • Supports Copy Back Program for fast data rewriting without external buffering
  • Includes Cache Read functionality to improve read throughput via internal buffers
  • Features hardware data protection that locks Program/Erase operations during power transitions
  • Provides CE Don't Care function for simplified microcontroller interfaces

Memory IC Applications

  • Solid state mass storage solutions
  • Industrial embedded systems requiring extended reliability
  • Cost-effective non-volatile memory applications

Memory IC Procurement Notes

Verify the specific ordering suffix matches the required voltage and temperature grade. Confirm the x8 interface width aligns with system bus requirements. Ensure the 63-ball FBGA footprint matches the PCB layout. Check RoHS compliance documentation if environmental regulations apply. Validate the ONFI 1.0 command set compatibility with the host controller firmware.

Memory IC Selection Notes

Select this component for designs requiring 4Gb density with x8 I/O width. Suitable for industrial environments operating between -40°C and 85°C. Choose when ONFI 1.0 compatibility is mandatory. Consider the 63FBGA package constraints for board space. Verify endurance requirements against the specified 100,000 P/E cycles for industrial grade.

Memory IC Part Context

This part belongs to the JSC NAND Series, which offers 1Gb to 8Gb densities in x8 and x16 configurations. The series is designed for cost-effective solid-state storage using SLC NAND technology. It shares pinout compatibility across densities within the same interface width, facilitating design migration. The series supports both 1.8V and 3.3V supply options depending on the specific model suffix.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided datasheet.

JS27HU4G08SDDA-25-SUJS27HU4G08SDDA-25-SU
$4.02
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