LDB181G8820C-110

$0.06

Description：MULTI-LAY HYBRID BALUNS
Series：LDB18
Mfr：Murata Electronics
Package：Tape & Reel (TR)

SKU:863e57bf2807 Category: Balun Brand: Murata Electronics

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Product introduction

LDB181G8820C-110 is listed in the Balun range at ChipApex. The manufacturer field lists Murata Electronics. Its product description is MULTI-LAY HYBRID BALUNS. Review the specifications below when checking this part for your BOM.

Balun specifications for LDB181G8820C-110

Description：MULTI-LAY HYBRID BALUNS
Series：LDB18
Mfr：Murata Electronics
Package：Tape & Reel (TR)
Frequency Range：1.85GHz ~ 1.91GHz
Impedance - Unbalanced/Balanced：50 / 200Ohm
Phase Difference：-
Insertion Loss (Max)：1.3dB
Return Loss (Min)：-
Package / Case：0603 (1608 Metric)
Mounting Type：Surface Mount

Balun datasheet and documents for LDB181G8820C-110

LDB181G8820C-110

Balun Overview

The LDB181G8820C-110 is a multi-layer hybrid balun manufactured by Murata Electronics, designed for RF applications. It operates within a frequency range of 1.85 GHz to 1.91 GHz and features impedance characteristics of 50 Ohms and 200 Ohms. The component utilizes a surface-mount 0603 (1608 Metric) package with physical dimensions of 1.6 mm length, 0.8 mm width, and 0.6 mm height. It supports a minimum operating temperature of -40°C and includes tin-plated terminals.

Balun Feature Summary

Multi-layer hybrid construction utilizing copper conductors and ceramic materials for high-frequency performance
Balanced-to-unbalanced signal conversion capability integrated into a compact surface-mount footprint

Balun Applications

RF front-end modules in wireless communication devices
Signal conditioning in mobile phone transceivers
High-frequency circuit interfaces requiring balanced-to-unbalanced transformation

Balun Procurement Notes

Verify part status carefully as this component is scheduled for obsolescence and will be discontinued by the manufacturer. Confirm availability through authorized distributors or secondary market suppliers. Ensure that any replacement components meet the same electrical specifications and physical footprint requirements to maintain design integrity.

Balun Selection Notes

Select this component only if the specific 1.85 GHz to 1.91 GHz frequency range and 50/200 Ohm impedance match the system requirements. Consider the 0603 package size constraints and the -40°C minimum operating temperature limit. Due to its obsolete status, evaluate long-term supply chain stability before finalizing the design.

Balun Part Context

This device belongs to the LDB series of multi-layer hybrid baluns from Murata Electronics. These components are engineered for RF applications, combining copper conductors and ceramic materials to support high-frequency operations. The series is characterized by small form factors suitable for modern electronic devices requiring efficient signal balancing.