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LTV-817S is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Lite-On Inc.. Its product description is OPTOISOLATOR 5KV 1CH TRANS 4-SMD. Review the specifications below when checking this part for your BOM.
The LTV-817S is a single-channel surface-mount photocoupler from Lite-On, utilizing an infrared LED and phototransistor for signal isolation. It features a SMD-4 package with wide pin spacing to facilitate automated assembly. The device provides high input-output isolation voltage of 5000Vrms and meets RoHS standards. Key electrical parameters include a minimum current transfer ratio (CTR) of 50% at IF=5mA and VCE=5V, typical rise/fall times of 4μs/3μs, and a maximum collector-emitter saturation voltage of 200mV. It operates within a temperature range of -30°C to +110°C.
Verify the specific suffix (e.g., TA, TP) against the required packaging format, as standard LTV-817S may refer to the component family rather than a specific reel configuration. Confirm RoHS compliance status if environmental regulations are strict. Ensure the selected variant matches the required lead frame material and insulation class for your application's safety certifications.
Select this component when space constraints require a surface-mount solution over through-hole DIP packages. The wide pin spacing reduces soldering defects compared to standard SOIC packages. Consider the CTR range and isolation voltage requirements to ensure compatibility with the driving circuit and load conditions. Verify thermal dissipation capabilities within the specified operating temperature range.
The LTV-817S belongs to the LTV-817 series, which includes various through-hole and surface-mount variants. This specific model represents the surface-mount version designed for high-density PCB layouts. It shares functional similarities with other optocouplers but offers distinct mechanical advantages due to its SMD-4 footprint and wide pin pitch.
LTV-817S-TA1
The typical rise time is 4μs and the typical fall time is 3μs under standard test conditions.
Yes, it is designed as a high-density mounting type with wide pin spacing to facilitate surface mount technology (SMT) processes.
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