Soc System On Chip M2S025T-1FCSG325I product image

M2S025T-1FCSG325I

$76.93
  • Description:IC SOC CORTEX-M3 166MHZ 325BGA
  • Series:SmartFusion®2

SKU:7b6820873da8 Category: Brand:

  
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M2S025T-1FCSG325I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 325BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for M2S025T-1FCSG325I

  • Description:IC SOC CORTEX-M3 166MHZ 325BGA
  • Series:SmartFusion®2
  • Mfr:Microchip Technology
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:ARM® Cortex®-M3
  • Flash Size:256KB
  • RAM Size:64KB
  • Peripherals:DDR, PCIe, SERDES
  • Connectivity:CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Speed:166MHz
  • Primary Attributes:FPGA - 25K Logic Modules
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:325-TFBGA, FCBGA
  • Supplier Device Package:325-FCBGA (11x11)

Soc System On Chip datasheet and documents for M2S025T-1FCSG325I

M2S025T-1FCSG325I

Soc System On Chip Overview

The M2S025T-1FCSG325I is a SmartFusion 2 System-on-Chip FPGA featuring an ARM Cortex-M3 microcontroller subsystem and a 27,696-logic element fabric. It operates within a junction temperature range of -40°C to 100°C (Industrial grade) with a typical core supply voltage of 1.2V. The device integrates embedded flash memory, hard DDR3 controllers, and high-speed SerDes interfaces on a single chip.

Soc System On Chip Feature Summary

  • Integrates ARM Cortex-M3 processor running at up to 166 MHz
  • Contains 27,696 logic elements and 256 KB of embedded flash
  • Supports industrial operating temperatures from -40°C to 100°C
  • Includes hard DDR3 memory controllers with error correction

Soc System On Chip Applications

  • Secure industrial control systems requiring real-time processing
  • Embedded applications utilizing integrated Ethernet, USB, and CAN peripherals
  • Low-power data acquisition and signal processing tasks

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' confirms the Industrial temperature grade (-40°C to 100°C). Confirm package designation FCSG325 corresponds to the Fine-pitch Ball Grid Array configuration. Ensure design tools support the SmartFusion 2 architecture for proper timing closure.

Soc System On Chip Selection Notes

Select this model when both programmable logic and a hardened MCU are required in a single component. The Industrial grade rating is necessary for environments exceeding standard commercial limits. Verify that the 27K logic density meets system complexity requirements before choosing higher-density variants.

Soc System On Chip Part Context

This part belongs to the SmartFusion 2 family, which combines low-power flash-based FPGA technology with a Microcontroller Subsystem. It is designed for applications demanding high security and reliability, distinguishing it from volatile SRAM-based FPGAs by its non-volatile configuration storage.

Soc System On Chip Replacement Considerations

Direct replacements include other SmartFusion 2 devices with compatible pinouts or updated densities such as the M2S050T series. Cross-family migration to IGLOO 2 requires significant architectural adjustments due to the absence of the integrated Cortex-M3 subsystem.

M2S025T-1FCSG325IM2S025T-1FCSG325I
$76.93
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