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M50-3902542 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Harwin Inc.. Its product description is CONN HEADER R/A 50POS 1.27MM. Review the specifications below when checking this part for your BOM.
The Harwin M50-3902542 is a male pin header from the ARCHER M50 series, designed for board-to-board and wire-to-board connections. It features a 1.27 mm (0.05 in) pitch with 50 positions arranged in a double inline configuration (25+25). The connector utilizes through-hole termination with solder pins and is oriented at a right angle. Constructed with phosphor bronze contacts gold-plated for reliability and a PBT housing, it supports a current rating of 500 mA per contact and operates within a temperature range of -40°C to +105°C.
Verify the specific suffix and packaging configuration against the manufacturer's latest datasheet before ordering. Confirm that the right-angle through-hole mounting style aligns with the target PCB design requirements. Ensure compatibility with mating sockets regarding row spacing and contact alignment to prevent assembly errors during production.
Select this component when a robust, high-pin-count connection is required in a constrained vertical space. The right-angle form factor is suitable for stacking or edge-connecting applications. Verify that the 1.27 mm pitch matches the existing footprint and that the 500 mA current rating meets the circuit load demands without exceeding thermal limits.
This part belongs to the ARCHER M50 series, which focuses on reliable rectangular connectors for demanding environments. The series is characterized by its consistent 1.27 mm pitch and various mounting options. The M50-3902542 specifically addresses the need for dense, right-angle male headers in professional electronic manufacturing.
Direct substitutes must match the 1.27 mm pitch, 50-position double inline configuration, and right-angle through-hole mounting. Verify that alternative components maintain equivalent current ratings and operating temperature ranges to ensure functional parity in the final assembly.
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