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M6060P-M3/P is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE ARR SCHOTT 60V 30A TO247AD. Review the specifications below when checking this part for your BOM.
The M6060P-M3/P is a dual common cathode Schottky rectifier manufactured by Vishay General Semiconductor - Diodes Division. It utilizes TMBS technology in a TO-247AD 3L package. The device features a maximum repetitive peak reverse voltage of 60 V and a total maximum average forward rectified current of 60 A (30 A per diode). It supports a peak forward surge current of 350 A per diode and operates within a junction temperature range of -65 °C to +150 °C.
Verify the specific ordering suffix against official documentation to confirm compliance status and packaging details. Confirm that the component meets RoHS requirements and halogen-free specifications as defined in the datasheet. Ensure thermal management aligns with the specified junction temperature limits during installation.
Select this component for applications requiring high surge capability and low forward voltage drop at elevated temperatures. Verify that the 60 V reverse voltage rating exceeds the circuit's peak inverse voltage. Consider the TO-247AD package dimensions and mounting torque requirements for mechanical integration.
This part belongs to the M6035P, M6045P, and M6060P series of dual common cathode Schottky rectifiers. All variants share identical electrical characteristics regarding current ratings, thermal resistance, and package type, differing only in their maximum repetitive peak reverse voltage ratings.
M6060P-E3/45
At an forward current of 30 A and a junction temperature of 25 °C, the maximum instantaneous forward voltage is 0.64 V.
The reverse current increases significantly with temperature; it is specified up to 600 µA at 25 °C and up to 160 mA at 125 °C.
The device can withstand a maximum solder dip temperature of 275 °C for a duration of 10 seconds, per JESD 22-B106.
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