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M80-4000000F9-03-322-00-000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Harwin Inc.. Its product description is 3 POS. FEMALE SIL VERTICAL THROU. Review the specifications below when checking this part for your BOM.
The M80-4000000F9-03-322-00-000 is a Harwin Datamate Mix-Tek female vertical through-hole connector with 3 positions. It features a 4.00mm pitch and gold-plated contacts. The component includes mounting hardware, a polarizing key, and jackscrews for secure fastening. Designed for power-to-board applications, it utilizes a black insulator made of glass-filled polyphenylene sulphide.
Verify the specific suffix codes against official Harwin documentation to confirm pin count, contact type, and mounting style. Ensure compatibility with corresponding male counterparts within the Datamate Mix-Tek series. Request updated datasheets directly from authorized distributors to validate current manufacturing specifications and environmental compliance status before procurement.
Select this variant for applications requiring vertical through-hole connectivity with fixed mounting points. The 3-position configuration suits low-pin-count power or signal lines. Verify that the required current rating aligns with system demands and that the jack screw mechanism fits the available panel thickness constraints compared to standard snap-fit alternatives.
This component belongs to the Harwin Datamate Mix-Tek family, designed for high-density interconnects. The M80 series specifically targets robust power and signal applications where mechanical security via jackscrews is preferred over simple latching mechanisms, offering enhanced vibration resistance in demanding environments.
Direct substitutes must match the 3-position female vertical through-hole form factor and 4.00mm pitch. Compatible parts include other Harwin M80 series variants with identical contact arrangements but different housing colors or terminal styles. Cross-brand replacements require careful verification of footprint dimensions and electrical ratings.
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