MBR30045CTRL

Diode Arrays Overview

The MBR30045CTRL is a Twin Tower Schottky diode module manufactured by GeneSiC Semiconductor. It features a maximum DC blocking voltage of 45 V and an average forward current rating of 300 A per package. The device exhibits a maximum instantaneous forward voltage of 0.60 V at Tc = 100 °C. Thermal performance includes a maximum junction-to-case thermal resistance of 0.40 °C/W per leg. Electrical specifications define a peak forward surge current of 2000 A per leg and a maximum reverse current of 5 mA at rated voltage with Tj = 100 °C. The component operates within a temperature range of -55 to 150 °C.

Diode Arrays Feature Summary

• Utilizes silicon Schottky technology for low forward voltage drop and high efficiency.
• Features a Twin Tower screw-mount package designed for robust mechanical stability.
• Provides high surge current capability suitable for demanding power conversion environments.

Diode Arrays Applications

• High-current DC-DC converter modules
• Free-wheeling rectification in motor drives
• Power supply output rectification

Diode Arrays Procurement Notes

Verify the specific ordering suffix against official GeneSiC documentation to confirm terminal configuration and marking details. Ensure thermal interface materials are compatible with the specified mounting style. Confirm that system heat sinking meets the required thermal resistance limits for the intended operating environment.

Diode Arrays Selection Notes

Select this module when applications require high current handling with minimal conduction losses. Evaluate the thermal management strategy to maintain junction temperatures within the specified operational range. Compare the forward voltage characteristics against alternative rectifiers to optimize overall system efficiency under load conditions.

Diode Arrays Part Context

This component belongs to the MBR300 series of silicon Schottky diode modules from GeneSiC Semiconductor. The series is engineered for high-power density applications requiring reliable rectification. The Twin Tower packaging facilitates efficient heat dissipation through direct mounting to cold plates or heatsinks.

Diode Arrays Replacement Considerations

Consult official cross-reference lists for verified substitutes. Ensure replacement parts match the 45 V voltage rating, 300 A current capacity, and Twin Tower package dimensions. Verify compatibility with existing thermal interface requirements.

Diode Arrays FAQ

What is the maximum junction-to-case thermal resistance?

The maximum thermal resistance from junction to case is 0.40 °C/W per leg.

What is the peak forward surge current rating?

The module supports a peak forward surge current of 2000 A per leg for an 8.3 ms half-sine pulse.

Does the part number suffix indicate a specific terminal configuration?

Yes, the suffix denotes the terminal configuration, which is marked on the product body.