MC100EP11MNTAG

Clock Buffers, Drivers Overview

The MC100EP11MNTAG is a differential 1:2 fanout buffer from the onsemi 100 Series, designed for high-speed clock distribution. It features temperature compensation and operates in PECL mode with VCC from 3.0 V to 5.5 V (VEE = 0 V) or NECL mode with VEE from −3.0 V to −5.5 V (VCC = 0 V). The device supports maximum clock frequencies exceeding 3 GHz, with typical propagation delays of 220 ps. It includes safety clamps on inputs and open input default states where Q outputs default LOW. Packaged in an 8-lead DFN (MN suffix), it meets RoHS standards.

Clock Buffers, Drivers Feature Summary

• Differential 1:2 fanout buffer with >3 GHz maximum frequency
• Typical propagation delay of 220 ps
• Supports PECL (3.0 V–5.5 V) and NECL (−3.0 V to −5.5 V) modes
• Temperature compensated for stable performance across operating range

Clock Buffers, Drivers Applications

• High-speed clock distribution networks
• PECL/NECL logic systems requiring fast AC performance
• Differential signal buffering in telecommunications infrastructure

Clock Buffers, Drivers Procurement Notes

Verify the MN suffix corresponds to the DFN-8 package (CASE 506AA) and confirm RoHS compliance status via official documentation. Check current availability as some variants in this family may be discontinued; consult onsemi for active production status.

Clock Buffers, Drivers Selection Notes

Select this component when differential ECL buffering with minimal skew (<25 ps max within device) is required. Ensure supply voltage matches PECL or NECL requirements. Verify thermal management needs for the DFN-8 package, noting junction-to-ambient resistance varies with airflow.

Clock Buffers, Drivers Part Context

Part of the MC10/100EP11 family, functionally equivalent to LVEL11 but with superior AC performance. The 100 Series distinguishes itself through internal temperature compensation compared to the standard 10 Series.

Clock Buffers, Drivers Replacement Considerations

MC10EP11DTG (TSSOP-8) and MC100EP11DG (SOIC-8N B) are pin-compatible alternatives within the same datasheet. Verify package dimensions and thermal characteristics differ between DFN, TSSOP, and SOIC options.