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MC10EP57DTG is listed in the Signal Switches, Multiplexers, Decoders range at ChipApex. The manufacturer field lists onsemi. Its product description is IC DIFF DIG MULTPL 1X4:1 20TSSOP. Review the specifications below when checking this part for your BOM.
The MC10EP57DTG is a fully differential 4:1 multiplexer from the MC10EP series, manufactured by onsemi. It operates in PECL mode with VCC ranging from 3.0 V to 5.5 V and VEE at 0 V, or in NECL mode with VCC at 0 V and VEE ranging from -3.0 V to -5.5 V. The device features typical propagation delays of 375 ps and supports maximum frequencies exceeding 2 GHz. It includes internal input pulldown resistors, safety clamps, and multiple VBB outputs for reference voltage generation. The component is housed in a TSSOP-20 package.
Verify current availability status directly with onsemi or authorized distributors, as specific variants within this family may be discontinued. Confirm that the DTG suffix corresponds to the TSSOP-20 package required for your design. Ensure compliance with RoHS standards and lead-free requirements before finalizing procurement orders.
Select the MC10EP57DTG when a fully differential 4:1 multiplexer is required for high-speed ECL applications. Consider the MC100EP57 variant if temperature compensation is necessary for operation across wider thermal ranges. Verify power supply compatibility with either PECL or NECL logic levels based on system voltage constraints.
This component belongs to the MC10EP series of ECL logic devices produced by onsemi. It is functionally related to the MC100EP57, which offers enhanced temperature compensation characteristics. The device is part of a broader portfolio of high-speed differential logic components designed for demanding timing and signal integrity applications.
The MC100EP57DTG serves as a direct functional replacement offering temperature compensation. Verify pinout compatibility and ensure that the absence of temperature compensation in the standard EP57 does not impact system reliability under varying thermal conditions.
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