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MK 214 X 3 26 G is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is Solder and plug pins, D0.5 mm. Review the specifications below when checking this part for your BOM.
The MK 214 X 3 26 G is a male pin header manufactured by Fischer Elektronik, designed for board-to-board and wire-to-board applications. It features solder and plug pins with a diameter of 0.5 mm for parallel PCB connection. The component has a contact pitch of 2.54 x 2.54 mm and contains 26 contacts. The contact material is a copper-zinc alloy with gold plating on the post finish. Insulation is provided by glass-filled polyamide (PA46). The operating temperature range is specified from -40°C to 163°C.
Verify the specific part number against official Fischer Elektronik documentation to confirm contact count and insulation specifications. Ensure that the required operating temperature range aligns with the component's rated limits of -40°C to 163°C. Confirm compatibility with mating connectors regarding pin diameter and pitch dimensions before procurement.
Select this connector when a 2.54 mm pitch male header is required for parallel PCB mounting. The 0.5 mm pin diameter suits applications needing precise alignment. Consider the gold-plated contacts for corrosion resistance and the glass-filled PA46 insulation for thermal stability up to 163°C during operation or reflow processes.
This component belongs to the Fischer Elektronik MK 214 series of male pin headers. The series is characterized by its use of solder and plug pins with a consistent 0.5 mm diameter. Variations within the series typically differ in the number of contacts while maintaining the same 2.54 mm pitch and construction materials.
Compatible substitutes must match the 2.54 mm pitch, 26-contact configuration, and 0.5 mm pin diameter. Verify that alternative components offer equivalent gold-plated contacts and operate within the -40°C to 163°C temperature range. Ensure the replacement uses compatible insulation materials for similar thermal performance.
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