MK LP 40 9 Z

Headers, Male Pins Overview

The MK LP 40 9 Z is a male pin header connector from Fischer Elektronik, designed for through-hole PCB mounting. It features a 9-position configuration with a standard 2.54 mm (0.100 inch) pitch spacing. The contacts are constructed from CuZn alloy and finished with a tin-plated surface to ensure reliable electrical connection and oxidation resistance. The component operates within a temperature range of -40°C to +163°C.

Headers, Male Pins Feature Summary

• Low profile design suitable for space-constrained applications
• Tin-plated contact surface ensures oxidation resistance
• Through-hole mounting for secure PCB attachment

Headers, Male Pins Applications

• General electronic circuit interconnections
• Prototyping boards requiring low-profile headers
• Consumer electronics assembly

Headers, Male Pins Procurement Notes

Verify the specific ordering suffix 'Z' against the manufacturer's current datasheet to confirm plating specifications and material composition. Ensure the required contact count matches the nine-position configuration. Confirm that the through-hole footprint aligns with the target PCB layout before procurement.

Headers, Male Pins Selection Notes

Select this component when a low-profile male header is required for through-hole assembly. The 2.54 mm pitch is standard for general-purpose connections. Consider the tin plating for environments where solderability and basic corrosion resistance are prioritized over gold-plated durability.

Headers, Male Pins Part Context

This part belongs to the MK LP 40 series, which offers various position counts and plating options. The '9 Z' designation specifies the nine-contact variant with tin plating. This series provides standardized low-profile solutions for board-to-board or cable connections in compact electronic devices.

Headers, Male Pins Replacement Considerations

Compatible substitutes include other Fischer Elektronik MK LP 40 variants with matching pitch and contact count, such as MK LP 40 9 G, provided the plating difference is acceptable for the application environment.