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MMP4405-GM2/TR is listed in the RF Diode range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is RF DIODE PIN 1000V 8W 0805. Review the specifications below when checking this part for your BOM.
The MMP4405-GM2/TR is a single PIN diode manufactured by Microchip Technology, designed for high-frequency applications ranging from 50 MHz to 12 GHz. It features a reverse voltage of 50 V and a maximum diode capacitance of 600 fF. The device supports a forward current of 100 mA with a carrier lifetime of 5 us. It operates within a temperature range of -55°C to +150°C and dissipates up to 8 W of power. Packaged in an 0805 SMD/SMT form factor, it exhibits a maximum series resistance of 750 mOhms at mid-frequency and a reverse current of 6 mA.
Verify the specific suffix designation against official Microchip documentation to confirm packaging configuration. Ensure that the requested variant matches the required reel specifications for surface-mount assembly processes. Confirm RoHS compliance status through the manufacturer's latest product data sheet before finalizing procurement orders.
Select this component when high isolation and low insertion loss are required in microwave circuits. Evaluate the 600 fF capacitance and 750 mOhm resistance parameters against circuit impedance requirements. Consider the 0805 package dimensions for PCB layout constraints and verify thermal management capabilities for the intended power dissipation levels.
This part belongs to the MMP4400 series of PIN diodes from Microchip Technology. The series provides silicon-based solutions for RF signal control. The specific model utilizes a single diode configuration optimized for high-speed switching applications in communication systems requiring reliable performance across wide bandwidths.
Consult Microchip technical support for verified cross-reference alternatives. Ensure any substitute maintains identical pinout compatibility and meets the 50 V reverse voltage and 12 GHz frequency specifications. Verify that thermal characteristics and package dimensions align with existing board layouts.
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